Solder Paste Flux Gel 14ml AG

Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. The gel flux can be applied through a sieve, a template or a syringe. Activators used in the production of flux allow to leave its remains after the soldering process on the package (unless the production process does not take into account the washing phases).

Features

• Does not require washing
• Printing time: 36 hours
• It retains tackiness for 72 hours
• Good solderability on surfaces: Ag, Cu, Au, Zn, Cd and SnPb